Lub suab sensors, raws li cov khoom siv uas hloov cov teeb liab acoustic rau hauv cov teeb liab hluav taws xob, nrhiav kev siv dav hauv kev lag luam automation, ntse tsev, kev kuaj mob, thiab lwm yam. Raws li lawv cov kev khiav hauj lwm cov hauv paus ntsiab lus thiab nrhiav kom tau lub hom phiaj, suab sensors feem ntau categorized raws li nram no:
I. Piezoelectric Sensors
Piezoelectric suab sensors leverage cov khoom ntawm cov khoom xws li quartz thiab ceramics. Thaum acoustic siab ua raws li cov khoom nto, nws induces hluav taws xob hloov pauv, yog li tsim hluav taws xob teeb liab. Cov sensors no muab siab rhiab heev thiab dav zaus teb, nrog rau cov kev siv xws li:
1. Microphones:Electret condenser microphones (ECMs) siv polarized electret zaj duab xis raws li lub diaphragm, muab tus nqi qis thiab compact loj, ua rau lawv siv dav hauv cov khoom siv hluav taws xob. MEMS microphones koom ua ke cov qauv me me ntawm cov khoom siv hluav taws xob los ntawm cov txheej txheem semiconductor, muaj zog tiv thaiv - muaj peev xwm cuam tshuam thiab zoo sib xws, feem ntau pom hauv smartphones.
2. Ultrasonic sensors:Feem ntau ua haujlwm siab tshaj 20kHz, cov no siv cov piezoelectric ceramics xa mus thiab tau txais ultrasonic tsis, haum rau cov ntawv thov xws li ntsuas qhov deb (xws li, qhov chaw nres tsheb sensors) thiab kev khiav dej num. Hauv cov khoom siv kho mob ultrasound, arrayed piezoelectric sensors ua tiav millimeter - theem daws teeb meem.
II. Electromagnetic Induction-Raws li Sensors
Cov no tsim hluav taws xob teeb liab los ntawm kev hloov pauv hauv magnetic teb, feem ntau suav nrog:
1. Tsiv -coil Microphones:Lub suab nthwv dej tsav lub kauj kom vibrate nyob rau hauv ib qho chaw sib nqus mus tas li, txiav cov kab sib nqus flux los tsim tam sim no. Lawv qhov dav dynamic ntau ua rau lawv xaiv ib qho kev xaiv rau cov cuab yeej kaw lus.
2. Electromagnetic Pickups:Coil pickups siv nyob rau hauv cov twj paj nruag zoo li guitars hloov magnetic teb zog los ntawm vibrating hlau hlua kom tso zis suab.
III. Optical Suab Sensors
Ua haujlwm tsis yog -cov cuab yeej tshawb nrhiav, xws li:
1. Laser Vibrometers:Ntsuas qhov kev vibrations ntawm cov nyhuv Doppler, haum rau siab - kub lossis muaj zog electromagnetic cuam tshuam ib puag ncig. Siv industrially los xyuas qhov txawv txav acoustic tsis tshwm sim los ntawm kev ua haujlwm tsis zoo.
2. Fiber Optic Acoustic Sensors:Siv cov cuab yeej uas suab nthwv dej hloov qhov refractive index ntawm optical fibers, ua kom muaj kev soj ntsuam acoustic. Cov tshuab no yog siv rau kev tshawb nrhiav cov roj pipeline.
IV. Capacitive Suab Sensors
Ua ke nrog lub phaj txav tau thiab lub phaj ruaj khov tsim cov qauv capacitive, lub suab tsis hloov lub phaj sib nrug, yog li hloov tus nqi capacitance. MEMS microphones nyob rau hauv pawg no, ua tiav cov teeb liab - mus rau - suab nrov piv ntau tshaj 70dB. Lwm hom, silicon microcapacitive microphone, siv cov txheej txheem semiconductor los tsim cov kab noj hniav me me, ua rau nws tsim nyog rau cov khoom siv kho mob auscultation.
V. Resistive Sound Sensors
Carbon-granule microphones yog ib qho piv txwv classic. Lub suab siab hloov pauv qhov kev sib cuag ntawm cov pa roj carbon granules, yog li hloov kho tam sim no. Txawm hais tias muaj cov yam ntxwv tsis zoo ntawm cov lus teb, lawv cov qauv yooj yim thiab tus nqi qis ua rau lawv siv dav hauv xov tooj thaum ntxov.
VI. Tshiab Intelligent Sensors
Kev nce qib thev naus laus zis tau coj mus rau qhov tshwm sim ntawm hybrid sensors sib xyaw ua ke ntau yam thev naus laus zis:
1. AI Voiceprint Recognition Modules:Kev koom ua ke DSP chips thiab kev kawm sib sib zog nqus algorithms, cov tshuaj ntsuam xyuas cov yam ntxwv tshwj xeeb hauv lub sijhawm tiag tiag rau kev ruaj ntseg ntse. Acoustic qauv muab los ntawm Baidu AI Qhib Platform ua tiav 98% qhov tseeb.
2. Multi-Parameter Environmental Sensors:Tib lub sijhawm ntsuas lub suab, kub, av noo, thiab lwm yam tsis. Piv txwv suav nrog cov suab nrov soj ntsuam cov davhlau ya nyob twg hauv cov nroog ntse, uas tso cov ntaub ntawv decibel mus rau huab platforms ntawm 4G tes hauj lwm.
Application Scenario Sib piv
| Hom Sensor | rhiab heev | Nqi | Hom Daim Ntawv Thov Scenarios |
| MEMS Microphone | Siab | Tsawg | Smartphones, ntse hais lus |
| Dynamic Microphone | Nruab nrab | Nruab nrab | Theem kev ua yeeb yam, tshaj tawm xov xwm kaw |
| Ultrasonic Sensor | Siab heev | kuj siab | Kev kho mob ultrasonography, kev lag luam uas tsis yog - kuaj kev puas tsuaj |
| Fiber -Optic Acoustic Sensor | Siab heev | Siab | Kev soj ntsuam roj thiab roj kav, kev tiv thaiv ciam teb thaum ntxov |
Kev Tsim Kho Kev Lag Luam
1. Miniaturization thiab kev koom ua ke:Cov neeg tsim khoom zoo li TSMC tau tshaj tawm MEMS microphone chips hauv 3mm × 2mm pob, nrog rau yav tom ntej muaj peev xwm rau SoC kev koom ua ke ntawm cov sensors thiab processors.
2. AI Empowerment:Lub moj khaum xws li Baidu's PaddlePaddle txhawb nqa ntug- sab acoustic qauv xa tawm, ua kom cov sensors nrog ntug kev muaj peev xwm. Piv txwv li, tus me nyuam mos quaj detectors tuaj yeem txheeb xyuas cov acoustic spectral nta hauv 200ms.
3. Tus kheej-Powering Technology:Georgia Tech's piezoelectric-triboelectric hybrid sensors harness ib puag ncig kev co zog, ua rau lawv zoo tagnrho rau IoT node li.
Thaum xaiv lub suab sensors, ntsuas qhov ntsuas tsis tau suav nrog ntau zaus (tib neeg hnov lus spans 20Hz-20kHz), rhiab heev (dB/V), thiab teeb liab-rau- suab nrov piv. Cov ntawv thov kev lag luam tseem xav tau kev saib xyuas kev tiv thaiv kev ntsuas (piv txwv li, IP67 plua plav thiab dej tsis kam) thiab kev hloov pauv kub (-40℃txog 85℃kev ua haujlwm ntau). Nrog rau kev loj hlob ntawm 5G thiab AIoT thev naus laus zis, lub suab sensors tau hloov zuj zus los ntawm cov teeb liab yooj yim tau txais mus rau cov kev xav tau ntse.